Oracle Manufacturing, LLC - Global Manufacturing Continued

Electronic Contract Manufacturing and Assembly Capabilities

Manufacturing:
• 780,000 Square Foot Facility
• 1,800 Employees
• PCB - PTH, SMT
• HLA/Box Build/System
• Configure-to-Order
• Build-to-Order
• Focused Factory Concept
• Lean Manufacturing
• Dedicated Rapid Prototyping Factories
• DFM
• Electro-mechanical
• Photonics
• Medical Class III
• Laminates: Rigid, PCMCIA, Rigid Flex, Flex, >.250" Thickness, Low Dk

Customer Focus:
• Customer Team
• Focused Factory
• Electronic Communications
• VIC
• DFX
• Cost Reduction Procedures
• Technology Roadmaps
• Market Segmentation

Materials:
• Distributors In-House
• Point of Use
• Flexibility Models
• Global IPO’s
• Direct and/or Distribution
• Assured Supply
• Custom Engineered Components
• Commodity Specialists
• Prototyping Materials Strategies

Quality:
• SPC
• Data Sharing
• Six Sigma Methodology
• Mature Quality Management System
• Continuous Improvement
• Registrations – ISO 9001:2000, ISO 13485/8, FDA (21 CFR Part 820)
• BellCore TR – NWT – 000078 Compliant
• NEBS

Processes:
• No-clean
• Surface Mount Technology
• Double Pass Reflow
• PTH Auto Insertion
• Pin-in-Paste (Intrusive Reflow)
• Conformal Coating
• Mechanical Assembly
• Backplane (Compliant Pin)
• Optical Fiber Fusion Splicing
• Lead-Free Processes

Component Technology:
• .4 mm Pitch QFP
• Flip Chip - > 1200 I/O,.01" Pitch
• BGA - > 1500 I/O
• CBGA - > 800 I/O
• CCGA - > 1500 I/O
• PGA - > 591 I/O
• Chip Scale Package (CSP)
• Passive Discrete - 0201
• Optical Actives and Passives

Test:
• DFT
• MDA – Takaya Flying Probe
• Automated Optical Inspection
• 2D & 3D X-Ray
• In-Circuit / Combinational
    - Agilent 307X, Agilent 3065
    - Genrad 228X, 227X
    - Teradyne 18XX
    - High Node Count > 7000
• Functional
    - RF
    - High Speed Communication
    - Full Custom
    - Nest Based
• Stress Screening
    - Thermal Cycle (-60 to 170o C)
    - Thermal Shock
    - Dynamic Functional
    - Vibration
    - Dual Axis
• System Test